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Fireproof Building Insulation Materials PIR Foam Boards Waterproof High Strength

Place of Origin Changzhou, Jiangsu,China
Brand Name Kaff Rees
Certification SGS
Minimum Order Quantity 20 Cubic Meters
Price Negotiable
Packaging Details Carton packaging/Wooden case packaging/according to the requirements
Delivery Time Negotiable
Payment Terms EXW/FOB/CIF
Supply Ability According to products
Product Details
Name PIR Foam Insulation Boards Feature Fireproof
Cold Insulation Material Polyisocyanurate PIR PH Value 5.5-7
Service Temp. -196~+120℃ Application Low Temperature Industries
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Waterproof Building PIR Foam Boards

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Fireproof Building Insulation Materials Board

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High Strength PIR Foam Boards

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Product Description
Fireproof Building Insulation Materials PIR Foam Boards

High-performance waterproof PIR foam insulation boards with excellent fire resistance and structural strength for industrial applications.

Key Advantages
  • Energy efficient insulation solution
  • Superior wind-resistance performance
  • Waterproof and fireproof properties
  • High structural strength
  • Long-lasting durability
  • Cost-effective solution
  • Environmentally friendly material
  • Premium quality at competitive pricing
Product Overview

Polyisocyanurate (PIR) is a high-performance foaming material created through the polymerization of isocyanate and polyether. Offering superior physical and fire resistance properties compared to polyurethane, PIR features minimal thermal conductivity and exceptional dimensional stability as an organic rigid thermal insulation material.

Technical Specifications
Item Unit Technical Data Test Mode
Density kg/m³ ≥40 ASTM D1622 / ISO 845
Thermal Conductivity W/(m*K) ≤0.035 (+100℃)
≤0.029 (+50℃)
≤0.025 (+10℃)
≤0.024 (0℃)
≤0.023 (-50℃)
≤0.022 (-100℃)
≤0.017 (-150℃)
≤0.016 (-170℃)
ASTM C177
Compressive Strength kPa +23℃: ≥200
-165℃: ≥280
ASTM D 1621
Tensile Strength kPa +23℃: ≥320
-165℃: ≥265
ASTM D 1623
Flame Spread Index ﹤25 ASTM E84
Oxygen index ≥30 GB/T 2406.2
Water Absorption by Vol. % ≤2 ASTM D2842
Water Vapor Permeability ng/(Pa*s*m) ≤5.5 ASTM E96
Closed Cell Ratio % ≥95 ASTM D6226
Lineal Thermal Expansion Coefficient m/(m*K) ≤70×10⁻⁶ ASTM D696
PH Value 5.5-7 ASTM C871
Chloride Content ppm ≤60 GB/T 11835
Elastic Modulus MPa ≤16 ASTM D1623
Service Temp. -196~+120
Applications

PIR foam boards serve as an ideal organic low-temperature insulation material, featuring minimal thermal conductivity and excellent dimensional stability. Suitable for a broad temperature range, these boards are extensively used in LNG facilities, ethylene plants, cold storage units, and various low-temperature industrial applications.

Typical PIR Insulation System Structure
PIR insulation system structure diagram
  1. PIR Shell: inner layer + middle layer (if necessary) + outer layer
  2. Secondary Vapor Barrier: PAP aluminum foil
  3. Main Vapor Barrier: mastic + fiberglass meshes + mastic
  4. Metal Protective Layer: aluminum alloy plate, stainless steel plate, aluminized steel plate, GRP
  5. Sealant: HS-10-02, Foster 95-50, etc
  6. Strapping Material: stainless steel tape, sub sensitive tape
Packing and Storage
  • Store in dry, lightproof, shady, and ventilated conditions
  • Keep away from heat sources and protect from direct sunlight
  • Inner packaging: black polyethylene bags
  • Outer packaging: protective cartons
Handling Instructions
  • Handle PIR materials gently to prevent damage
  • Avoid rolling, collision, or heavy pressure during transportation
  • For pipe and equipment insulation, secure with glass fiber tape or steel bands
  • Use saws for cutting during installation
Production Process
PIR foam board production flow diagram