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High Stability Polyiso Foam Board Thermal Insulation Material ASTM D1622 ISO 845

High Stability Polyiso Foam Board Thermal Insulation Material ASTM D1622 ISO 845

Brand Name: Kaff Rees
MOQ: 20 Cubic Meters
Price: Negotiable
Payment Terms: EXW/FOB/CIF
Supply Ability: According to products
Detail Information
Place of Origin:
Changzhou, Jiangsu,China
Certification:
SGS
Name:
Polyiso Foam Board
Feature:
High Dimensional Stability
Cold Insulation Material:
Polyisocyanurate PIR
PH Value:
5.5-7
Service Temp.:
-196~+120℃
Application:
Low Temperature Industries
Packaging Details:
Carton packaging/Wooden case packaging/according to the requirements
Highlight:

ASTM D1622 Polyisocyanurate Foam Board

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Thermal Insulation Polyiso Foam Board

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High Stability Polyiso Foam Board

Product Description
High Stability Polyiso Foam Board Thermal Insulation Material ASTM D1622 ISO 845
Application

This high-performance organic low-temperature thermal insulation material features excellent thermal conductivity and dimensional stability. Ideal for LNG, ethylene, cold storage, and other low-temperature industrial applications.

Product Introduction

Polyisocyanurate (PIR) is a premium foaming material created through isocyanate and polyether polymerization. Offering superior physical and fire resistance properties compared to polyurethane, it provides exceptional thermal insulation performance with outstanding dimensional stability.

Key Features
  • B1 fire resistance rating
  • Operating temperature range: -196℃ to +120℃
  • Excellent dimensional stability
  • Customizable panel and pipe cutting options
Technical Properties
Item Unit Technical Data Test Mode
Density kg/m3 ≥40 ASTM D1622 / ISO 845
Thermal Conductivity W/(m*K) ≤0.035 (+100℃)
≤0.029 (+50℃)
≤0.025 (+10℃)
≤0.024 (0℃)
≤0.023 (-50℃)
≤0.022 (-100℃)
≤0.017 (-150℃)
≤0.016 (-170℃)
ASTM C177
Compressive Strength kPa +23℃: ≥200
-165℃: ≥280
ASTM D 1621
Tensile Strength kPa +23℃: ≥320
-165℃: ≥265
ASTM D 1623
Flame Spread Index ﹤25 ASTM E84
Oxygen index ≥30 GB/T 2406.2
Water Absorption by Vol. % ≤2 ASTM D2842
Water Vapor Permeability ng/(Pa*s*m) ≤5.5 ASTM E96
Closed Cell Ratio % ≥95 ASTM D6226
Lineal Thermal Expansion Coefficient m/(m*K) ≤70×10-6 ASTM D696
PH Value 5.5-7 ASTM C871
Chloride Content ppm ≤60 GB/T 11835
Elastic Modulus MPa ≤16 ASTM D1623
Service Temp. -196~+120
Typical PIR Insulation System Structure
High Stability Polyiso Foam Board Thermal Insulation Material ASTM D1622  ISO 845 0
  1. PIR Shell: inner layer + middle layer (if necessary) + outer layer
  2. Secondary Vapor Barrier: PAP aluminum foil
  3. Main Vapor Barrier: mastic + fiberglass meshes + mastic
  4. Metal Protective Layer: aluminum alloy plate, stainless steel plate, aluminized steel plate, GRP
  5. Sealant: HS-10-02, Foster 95-50, etc
  6. Strapping Material: stainless steel tape, sub sensitive tape
Packing and Storage
  • Store in dry, lightproof, shady, and ventilated conditions away from heat sources and direct sunlight
  • Packaged in black polyethylene bags inside protective cartons
Handling Cautions
  • Handle PIR materials gently - avoid rolling, collision, or heavy pressure during transport
  • Secure pipe and equipment insulation with glass fiber tape or steel bands
  • Use saws for cutting during installation
Production Flow
High Stability Polyiso Foam Board Thermal Insulation Material ASTM D1622  ISO 845 1