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Multipurpose Building Insulation Materials PIR Insulation Board For Low Temperature Industry

Multipurpose Building Insulation Materials PIR Insulation Board For Low Temperature Industry

Brand Name: Kaff Rees
MOQ: 20 Cubic Meters
Price: Negotiable
Payment Terms: EXW/FOB/CIF
Supply Ability: According to products
Detail Information
Place of Origin:
Changzhou, Jiangsu,China
Certification:
SGS
Name:
PIR Insulation Board
PH Value:
5.5-7
Cold Insulation Material:
Polyisocyanurate PIR
Feature:
High Performance
Service Temp.:
-196~+120℃
Application:
Low Temperature Industries
Packaging Details:
Carton packaging/Wooden case packaging/according to the requirements
Highlight:

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Product Description
Multipurpose PIR Insulation Board for Low Temperature Applications
Polyisocyanurate (PIR) is a high-performance foaming material created through the polymerization of isocyanate and polyether. Offering superior physical properties and fire resistance compared to polyurethane, PIR insulation features minimal thermal conductivity and excellent dimensional stability, making it an ideal organic hard thermal insulation material.
Key Features
  • B1 fire resistance rating
  • Wide operating temperature range: -196°C to +120°C
  • Exceptional dimensional stability
  • Customizable panel and pipe cutting options available
Technical Specifications
Property Unit Value Test Method
Density kg/m³ ≥40 ASTM D1622 / ISO 845
Thermal Conductivity W/(m·K) ≤0.035 (+100°C)
≤0.029 (+50°C)
≤0.025 (+10°C)
≤0.024 (0°C)
≤0.023 (-50°C)
≤0.022 (-100°C)
≤0.017 (-150°C)
≤0.016 (-170°C)
ASTM C177
Compressive Strength kPa ≥200 (+23°C)
≥280 (-165°C)
ASTM D1621
Tensile Strength kPa ≥320 (+23°C)
≥265 (-165°C)
ASTM D1623
Flame Spread Index ﹤25 ASTM E84
Oxygen Index ≥30 GB/T 2406.2
Water Absorption by Volume % ≤2 ASTM D2842
Water Vapor Permeability ng/(Pa·s·m) ≤5.5 ASTM E96
Closed Cell Ratio % ≥95 ASTM D6226
Linear Thermal Expansion Coefficient m/(m·K) ≤70×10⁻⁶ ASTM D696
pH Value 5.5-7 ASTM C871
Chloride Content ppm ≤60 GB/T 11835
Elastic Modulus MPa ≤16 ASTM D1623
Service Temperature °C -196 to +120
Applications
PIR insulation is the ideal organic low-temperature thermal insulation material, featuring minimal thermal conductivity and outstanding dimensional stability. Suitable for a broad temperature range, it is widely used in LNG plants, ethylene production facilities, cold storage units, and other low-temperature industrial applications.
Typical PIR Insulation System Structure
Multipurpose Building Insulation Materials PIR Insulation Board For Low Temperature Industry 0
  1. PIR Shell: Inner layer + middle layer (if required) + outer layer
  2. Secondary Vapor Barrier: PAP aluminum foil
  3. Main Vapor Barrier: Mastic + fiberglass meshes + mastic
  4. Metal Protective Layer: Aluminum alloy plate, stainless steel plate, aluminized steel plate, or GRP
  5. Sealant: HS-10-02, Foster 95-50, etc.
  6. Strapping Material: Stainless steel tape, sub-sensitive tape
Packaging & Storage
  • Store in dry, lightproof, shaded, and ventilated areas
  • Keep away from heat sources and protect from direct sunlight
  • Inner packaging: black polyethylene bags
  • Outer packaging: protective cartons
Handling Instructions
  • Handle PIR materials gently to avoid rolling, collision, or heavy pressure during transport
  • For pipe and equipment insulation, secure PIR with glass fiber tape or steel bands
  • Use saws for cutting during installation
Production Process
Multipurpose Building Insulation Materials PIR Insulation Board For Low Temperature Industry 1