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Easy Cutting PIR Insulation Board High Tensile Strength Polyiso Insulation Panels

Brand Name:	Kaff Rees
MOQ:	20 Cubic Meters
Price:	Negotiable
Payment Terms:	EXW/FOB/CIF
Supply Ability:	According to products

Detail Information

Product Description

Detail Information

Place of Origin:

Changzhou, Jiangsu,China

Certification:

SGS

Name:

Thermal PIR Board

Feature:

Easy Cutting

Cold Insulation Material:

Polyisocyanurate PIR

PH Value:

5.5-7

Service Temp.:

-196～+120℃

Application:

Low Temperature Industries

Packaging Details:

Carton packaging/Wooden case packaging/according to the requirements

Highlight:

High Tensile Strength Polyiso Panels

Easy Cutting PIR Insulation Board

Product Description

Easy Cutting PIR Insulation Board High Tensile Strength Polyiso Insulation Panels

Why Choose Our PIR Insulation Boards?

Largest manufacturer and industry leader in China
Multiple style options available
Consistently high quality at competitive prices
Short production lead times
Sample orders and small quantities welcome
Dedicated customer service support

Polyisocyanurate (PIR) is a high-performance foaming material created through the polymerization of isocyanate and polyether. Offering superior physical and fire resistance properties compared to polyurethane, PIR insulation features minimal thermal conductivity and excellent dimensional stability as an organic rigid thermal insulation material.

Key Features

Fire resistance rated B1
Operating temperature range: -196℃ to +120℃
Exceptional dimensional stability
Customizable panel and pipe cutting options

Technical Specifications

Item	Unit	Technical Data	Test Mode
Density	kg/m3	≥40	ASTM D1622 / ISO 845
Thermal Conductivity	W/(m*K)	≤0.035 (+100℃) ≤0.029 (+50℃) ≤0.025 (+10℃) ≤0.024 (0℃) ≤0.023 (-50℃) ≤0.022 (-100℃) ≤0.017 (-150℃) ≤0.016 (-170℃)	ASTM C177
Compressive Strength	kPa	≥200 (+23℃) ≥280 (-165℃)	ASTM D 1621
Tensile Strength	kPa	≥320 (+23℃) ≥265 (-165℃)	ASTM D 1623
Flame Spread Index		﹤25	ASTM E84
Oxygen index		≥30	GB/T 2406.2
Water Absorption by Vol.	%	≤2	ASTM D2842
Water Vapor Permeability	ng/(Pasm)	≤5.5	ASTM E96
Closed Cell Ratio	%	≥95	ASTM D6226
Lineal Thermal Expansion Coefficient	m/(m*K)	≤70×10-6	ASTM D696
PH Value		5.5-7	ASTM C871
Chloride Content	ppm	≤60	GB/T 11835
Elastic Modulus	MPa	≤16	ASTM D1623
Service Temp.	℃	-196～+120

Applications

As an ideal organic low-temperature insulation material, PIR boards combine minimal thermal conductivity with outstanding dimensional stability. Suitable for a broad temperature range, they are widely used in LNG, ethylene production, cold storage, and other low-temperature industrial applications.

Typical PIR Insulation System Structure

PIR Shell: inner layer + middle layer (if necessary) + outer layer
Secondary Vapor Barrier: PAP aluminum foil
Main Vapor Barrier: mastic + fiberglass meshes + mastic
Metal Protective Layer: aluminum alloy plate, stainless steel plate, aluminized steel plate, GRP
Sealant: HS-10-02, Foster 95-50, etc
Strapping Material: stainless steel tape, sub sensitive tape

Packing and Storage Guidelines

Store in dry, shaded, well-ventilated areas away from heat sources and direct sunlight
Inner packaging: black polyethylene bags; Outer packaging: protective cartons

Handling Cautions

Handle PIR materials gently - avoid rolling, collisions, or heavy pressure during transport
Secure pipe and equipment insulation with glass fiber tape or steel bands
Use saws for precise cutting during installation

Production Process

Tags:

Pipe Insulation Materials

Pipe Insulation Supports

Pipe Insulation Auxiliary Materials

Building Insulation Materials

Polyisocyanurate Foam Pipe Insulation

Hard Polyurethane

Foam Glass Insulation

Sealant Putty

PIR Insulated Pipe Supports

products details

Easy Cutting PIR Insulation Board High Tensile Strength Polyiso Insulation Panels

Easy Cutting PIR Insulation Board High Tensile Strength Polyiso Insulation Panels

High Tensile Strength Polyiso Panels

Easy Cutting PIR Insulation Board

Building Insulation Board

Thermal Insulation Material

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