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PH 5.5-7 PIR Building Insulation Materials Polyiso Foam Board Lightweight Tough

Place of Origin Changzhou, Jiangsu,China
Brand Name Kaff Rees
Certification SGS
Minimum Order Quantity 20 Cubic Meters
Price Negotiable
Packaging Details Carton packaging/Wooden case packaging/according to the requirements
Delivery Time Negotiable
Payment Terms EXW/FOB/CIF
Supply Ability According to products
Product Details
Name Polyiso Foam Board Feature Excellent Dimension Stability
Cold Insulation Material Polyisocyanurate PIR PH Value 5.5-7
Service Temp. -196~+120℃ Application Low Temperature Industries
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Lightweight polyisocyanurate insulation board

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PH 5.5 Polyiso Foam Board

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PIR Building Insulation Materials Board

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Product Description
PH 5.5-7 PIR Building Insulation Materials Polyiso Foam Board
Kaff Rees is a leading manufacturer specializing in high-performance insulation solutions. Our PIR (Polyisocyanurate) foam board is a premium insulation material with exceptional thermal performance and fire resistance properties.
Product Overview
Polyisocyanurate (PIR) is a superior foaming material created through the polymerization of isocyanate and polyether. Offering better physical and fire resistance properties than polyurethane, PIR features minimal thermal conductivity and excellent dimensional stability, making it an ideal organic hard thermal insulation material.
Key Features
  • Fire resistance rated as B1
  • Operating temperature range: -196℃ to +120℃
  • Excellent dimensional stability
  • Customizable cutting in panels and pipes to meet specific requirements
Technical Specifications
Item Unit Technical Data Test Mode
Density kg/m3 ≥40 ASTM D1622 / ISO 845
Thermal Conductivity W/(m*K) ≤0.035 (+100℃)
≤0.029 (+50℃)
≤0.025 (+10℃)
≤0.024 (0℃)
≤0.023 (-50℃)
≤0.022 (-100℃)
≤0.017 (-150℃)
≤0.016 (-170℃)
ASTM C177
Compressive Strength kPa ≥200 (+23℃)
≥280 (-165℃)
ASTM D 1621
Tensile Strength kPa ≥320 (+23℃)
≥265 (-165℃)
ASTM D 1623
Flame Spread Index ﹤25 ASTM E84
Oxygen index ≥30 GB/T 2406.2
Water Absorption by Vol. % ≤2 ASTM D2842
Water Vapor Permeability ng/(Pa*s*m) ≤5.5 ASTM E96
Closed Cell Ratio % ≥95 ASTM D6226
Lineal Thermal Expansion Coefficient m/(m*K) ≤70×10-6 ASTM D696
PH Value 5.5-7 ASTM C871
Chloride Content ppm ≤60 GB/T 11835
Elastic Modulus MPa ≤16 ASTM D1623
Service Temp. -196~+120
Applications
PIR foam board is an ideal organic low-temperature insulation material with minimal thermal conductivity and excellent dimensional stability. Suitable for a wide temperature range, it is extensively used in LNG, ethylene production, cold storage, and other low-temperature industrial applications.
Typical PIR Insulation System Structure
PIR insulation system structure diagram
  1. PIR Shell: inner layer + middle layer (if necessary) + outer layer
  2. Secondary Vapor Barrier: PAP aluminum foil
  3. Main Vapor Barrier: mastic + fiberglass meshes + mastic
  4. Metal Protective Layer: aluminum alloy plate, stainless steel plate, aluminized steel plate, GRP
  5. Sealant: HS-10-02, Foster 95-50, etc.
  6. Strapping Material: stainless steel tape, sub sensitive tape
Packing and Storage
  • Store in a dry, lightproof, shady, and ventilated area
  • Keep away from heat sources and protect from direct sunlight
  • Inner packaging: black polyethylene bags
  • Outer packaging: protective cartons
Handling Instructions
  • Handle PIR materials gently to avoid rolling, collision, or heavy pressure during transportation
  • For pipe and equipment insulation, secure PIR with glass fiber tape or steel bands
  • Use a saw for cutting during installation
Production Process
PIR foam board production process diagram