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PH 5.5-7 PIR Building Insulation Materials Polyiso Foam Board Lightweight Tough

Brand Name:	Kaff Rees
MOQ:	20 Cubic Meters
Price:	Negotiable
Payment Terms:	EXW/FOB/CIF
Supply Ability:	According to products

Detail Information

Product Description

Detail Information

Place of Origin:

Changzhou, Jiangsu,China

Certification:

SGS

Name:

Polyiso Foam Board

Feature:

Excellent Dimension Stability

Cold Insulation Material:

Polyisocyanurate PIR

PH Value:

5.5-7

Service Temp.:

-196～+120℃

Application:

Low Temperature Industries

Packaging Details:

Carton packaging/Wooden case packaging/according to the requirements

Highlight:

Lightweight polyisocyanurate insulation board

PH 5.5 Polyiso Foam Board

PIR Building Insulation Materials Board

Product Description

PH 5.5-7 PIR Building Insulation Materials Polyiso Foam Board

Kaff Rees is a leading manufacturer specializing in high-performance insulation solutions. Our PIR (Polyisocyanurate) foam board is a premium insulation material with exceptional thermal performance and fire resistance properties.

Product Overview

Polyisocyanurate (PIR) is a superior foaming material created through the polymerization of isocyanate and polyether. Offering better physical and fire resistance properties than polyurethane, PIR features minimal thermal conductivity and excellent dimensional stability, making it an ideal organic hard thermal insulation material.

Key Features

Fire resistance rated as B1
Operating temperature range: -196℃ to +120℃
Excellent dimensional stability
Customizable cutting in panels and pipes to meet specific requirements

Technical Specifications

Item	Unit	Technical Data	Test Mode
Density	kg/m3	≥40	ASTM D1622 / ISO 845
Thermal Conductivity	W/(m*K)	≤0.035 (+100℃) ≤0.029 (+50℃) ≤0.025 (+10℃) ≤0.024 (0℃) ≤0.023 (-50℃) ≤0.022 (-100℃) ≤0.017 (-150℃) ≤0.016 (-170℃)	ASTM C177
Compressive Strength	kPa	≥200 (+23℃) ≥280 (-165℃)	ASTM D 1621
Tensile Strength	kPa	≥320 (+23℃) ≥265 (-165℃)	ASTM D 1623
Flame Spread Index		﹤25	ASTM E84
Oxygen index		≥30	GB/T 2406.2
Water Absorption by Vol.	%	≤2	ASTM D2842
Water Vapor Permeability	ng/(Pasm)	≤5.5	ASTM E96
Closed Cell Ratio	%	≥95	ASTM D6226
Lineal Thermal Expansion Coefficient	m/(m*K)	≤70×10-6	ASTM D696
PH Value		5.5-7	ASTM C871
Chloride Content	ppm	≤60	GB/T 11835
Elastic Modulus	MPa	≤16	ASTM D1623
Service Temp.	℃	-196～+120

Applications

PIR foam board is an ideal organic low-temperature insulation material with minimal thermal conductivity and excellent dimensional stability. Suitable for a wide temperature range, it is extensively used in LNG, ethylene production, cold storage, and other low-temperature industrial applications.

Typical PIR Insulation System Structure

PIR Shell: inner layer + middle layer (if necessary) + outer layer
Secondary Vapor Barrier: PAP aluminum foil
Main Vapor Barrier: mastic + fiberglass meshes + mastic
Metal Protective Layer: aluminum alloy plate, stainless steel plate, aluminized steel plate, GRP
Sealant: HS-10-02, Foster 95-50, etc.
Strapping Material: stainless steel tape, sub sensitive tape

Packing and Storage

Store in a dry, lightproof, shady, and ventilated area
Keep away from heat sources and protect from direct sunlight
Inner packaging: black polyethylene bags
Outer packaging: protective cartons

Handling Instructions

Handle PIR materials gently to avoid rolling, collision, or heavy pressure during transportation
For pipe and equipment insulation, secure PIR with glass fiber tape or steel bands
Use a saw for cutting during installation

Production Process

Tags:

Pipe Insulation Materials

Pipe Insulation Supports

Pipe Insulation Auxiliary Materials

Building Insulation Materials

Polyisocyanurate Foam Pipe Insulation

Hard Polyurethane

Foam Glass Insulation

Sealant Putty

PIR Insulated Pipe Supports

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