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OEM Fire Resistant PIR Insulation Board Organic Hard Thermal Insulation Material
| Place of Origin | Changzhou, Jiangsu,China |
|---|---|
| Brand Name | Kaff Rees |
| Certification | SGS |
| Minimum Order Quantity | 20 Cubic Meters |
| Price | Negotiable |
| Packaging Details | Carton packaging/Wooden case packaging/according to the requirements |
| Delivery Time | Negotiable |
| Payment Terms | EXW/FOB/CIF |
| Supply Ability | According to products |
Product Details
| Name | PIR Insulation Board | Feature | High Dimensional Stability |
|---|---|---|---|
| Cold Insulation Material | Polyisocyanurate PIR | PH Value | 5.5-7 |
| Service Temp. | -196～+120℃ | Application | Low Temperature Industries |
| Highlight | Organic Hard PIR Insulation Board,OEM PIR Insulation Board |
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Product Description
OEM Fire Resistant PIR Insulation Board Organic Hard Thermal Insulation Material
Polyisocyanurate (PIR) is a high-performance foaming material created through the polymerization of isocyanate and polyether. Offering superior physical properties and fire resistance compared to polyurethane, PIR insulation features minimal thermal conductivity and excellent dimensional stability as an organic hard thermal insulation material.
Key Features
- Fire resistance rated B1
- Operating temperature range: -196℃ to +120℃
- Exceptional dimensional stability
- Customizable panel and pipe cutting options
Technical Specifications
| Property | Unit | Value | Test Method |
|---|---|---|---|
| Density | kg/m³ | ≥40 | ASTM D1622 / ISO 845 |
| Thermal Conductivity | W/(m·K) |
≤0.035 (+100℃) ≤0.029 (+50℃) ≤0.025 (+10℃) ≤0.024 (0℃) ≤0.023 (-50℃) ≤0.022 (-100℃) ≤0.017 (-150℃) ≤0.016 (-170℃) |
ASTM C177 |
| Compressive Strength | kPa | ≥200 (+23℃) ≥280 (-165℃) |
ASTM D1621 |
| Tensile Strength | kPa | ≥320 (+23℃) ≥265 (-165℃) |
ASTM D1623 |
| Flame Spread Index | <25 | ASTM E84 | |
| Oxygen Index | ≥30 | GB/T 2406.2 | |
| Water Absorption by Volume | % | ≤2 | ASTM D2842 |
| Water Vapor Permeability | ng/(Pa·s·m) | ≤5.5 | ASTM E96 |
| Closed Cell Ratio | % | ≥95 | ASTM D6226 |
| Linear Thermal Expansion Coefficient | m/(m·K) | ≤70×10⁻⁶ | ASTM D696 |
| pH Value | 5.5-7 | ASTM C871 | |
| Chloride Content | ppm | ≤60 | GB/T 11835 |
| Elastic Modulus | MPa | ≤16 | ASTM D1623 |
| Service Temperature | ℃ | -196 to +120 |
Applications
As an ideal organic low-temperature insulation material, PIR boards combine minimal thermal conductivity with outstanding dimensional stability. Suitable for extreme temperature ranges, they are widely used in LNG facilities, ethylene plants, cold storage systems, and other low-temperature industrial applications.
Typical PIR Insulation System Structure
- PIR Shell: Inner layer + middle layer (if required) + outer layer
- Secondary Vapor Barrier: PAP aluminum foil
- Main Vapor Barrier: Mastic + fiberglass meshes + mastic
- Metal Protective Layer: Aluminum alloy plate, stainless steel plate, aluminized steel plate, or GRP
- Sealant: HS-10-02, Foster 95-50, etc.
- Strapping Material: Stainless steel tape, sub sensitive tape
Packaging & Storage
- Store in dry, shaded, well-ventilated areas away from heat sources and direct sunlight
- Inner packaging: Black polyethylene bags; Outer packaging: Protective cartons
Handling Instructions
- Handle PIR materials gently - avoid rolling, collisions, or heavy pressure during transport
- Secure pipe and equipment insulation with glass fiber tape or steel bands
- Use saws for precise cutting during installation
Production Process
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