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OEM Fire Resistant PIR Insulation Board Organic Hard Thermal Insulation Material

OEM Fire Resistant PIR Insulation Board Organic Hard Thermal Insulation Material

Brand Name: Kaff Rees
MOQ: 20 Cubic Meters
Price: Negotiable
Payment Terms: EXW/FOB/CIF
Supply Ability: According to products
Detail Information
Place of Origin:
Changzhou, Jiangsu,China
Certification:
SGS
Name:
PIR Insulation Board
Feature:
High Dimensional Stability
Cold Insulation Material:
Polyisocyanurate PIR
PH Value:
5.5-7
Service Temp.:
-196~+120℃
Application:
Low Temperature Industries
Packaging Details:
Carton packaging/Wooden case packaging/according to the requirements
Highlight:

Organic Hard PIR Insulation Board

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OEM PIR Insulation Board

Product Description
OEM Fire Resistant PIR Insulation Board Organic Hard Thermal Insulation Material
Polyisocyanurate (PIR) is a high-performance foaming material created through the polymerization of isocyanate and polyether. Offering superior physical properties and fire resistance compared to polyurethane, PIR insulation features minimal thermal conductivity and excellent dimensional stability as an organic hard thermal insulation material.
Key Features
  • Fire resistance rated B1
  • Operating temperature range: -196℃ to +120℃
  • Exceptional dimensional stability
  • Customizable panel and pipe cutting options
Technical Specifications
Property Unit Value Test Method
Density kg/m³ ≥40 ASTM D1622 / ISO 845
Thermal Conductivity W/(m·K) ≤0.035 (+100℃)
≤0.029 (+50℃)
≤0.025 (+10℃)
≤0.024 (0℃)
≤0.023 (-50℃)
≤0.022 (-100℃)
≤0.017 (-150℃)
≤0.016 (-170℃)
ASTM C177
Compressive Strength kPa ≥200 (+23℃)
≥280 (-165℃)
ASTM D1621
Tensile Strength kPa ≥320 (+23℃)
≥265 (-165℃)
ASTM D1623
Flame Spread Index <25 ASTM E84
Oxygen Index ≥30 GB/T 2406.2
Water Absorption by Volume % ≤2 ASTM D2842
Water Vapor Permeability ng/(Pa·s·m) ≤5.5 ASTM E96
Closed Cell Ratio % ≥95 ASTM D6226
Linear Thermal Expansion Coefficient m/(m·K) ≤70×10⁻⁶ ASTM D696
pH Value 5.5-7 ASTM C871
Chloride Content ppm ≤60 GB/T 11835
Elastic Modulus MPa ≤16 ASTM D1623
Service Temperature -196 to +120
Applications
As an ideal organic low-temperature insulation material, PIR boards combine minimal thermal conductivity with outstanding dimensional stability. Suitable for extreme temperature ranges, they are widely used in LNG facilities, ethylene plants, cold storage systems, and other low-temperature industrial applications.
Typical PIR Insulation System Structure
OEM Fire Resistant PIR Insulation Board Organic Hard Thermal Insulation Material 0
  • PIR Shell: Inner layer + middle layer (if required) + outer layer
  • Secondary Vapor Barrier: PAP aluminum foil
  • Main Vapor Barrier: Mastic + fiberglass meshes + mastic
  • Metal Protective Layer: Aluminum alloy plate, stainless steel plate, aluminized steel plate, or GRP
  • Sealant: HS-10-02, Foster 95-50, etc.
  • Strapping Material: Stainless steel tape, sub sensitive tape
Packaging & Storage
  • Store in dry, shaded, well-ventilated areas away from heat sources and direct sunlight
  • Inner packaging: Black polyethylene bags; Outer packaging: Protective cartons
Handling Instructions
  • Handle PIR materials gently - avoid rolling, collisions, or heavy pressure during transport
  • Secure pipe and equipment insulation with glass fiber tape or steel bands
  • Use saws for precise cutting during installation
Production Process
OEM Fire Resistant PIR Insulation Board Organic Hard Thermal Insulation Material 1