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Rigid PIR Insulation Board , PIR Foam Board High Dimensional Stability
| Place of Origin | Changzhou, Jiangsu,China |
|---|---|
| Brand Name | Kaff Rees |
| Certification | SGS |
| Minimum Order Quantity | 20 Cubic Meters |
| Price | Negotiable |
| Packaging Details | Carton packaging/Wooden case packaging/according to the requirements |
| Delivery Time | Negotiable |
| Payment Terms | EXW/FOB/CIF |
| Supply Ability | According to products |
Product Details
| Name | Rigid PIR Insulation Board | Cold Insulation Material | Polyisocyanurate PIR |
|---|---|---|---|
| Feature | High Dimensional Stability | PH Value | 5.5-7 |
| Service Temp. | -196～+120℃ | Application | Low Temperature Industries |
| Highlight | polyisocyanurate insulation board,pir foam insulation boards |
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Product Description
Rigid PIR Insulation Board, PIR Foam Board High Dimensional Stability
Key Features
- Fire resistance rated as B1
- Operating temperature range -196℃ to +120℃
- Excellent dimensional stability
- Customizable cutting in panels and pipes according to requirements
Product Introduction
Polyisocyanurate (PIR) is a foaming material made by the polymerization of isocyanate and polyether. With superior physical and fire resistance properties compared to polyurethane, it offers excellent thermal insulation with small thermal conductivity and high dimensional stability. This organic rigid thermal insulation material is ideal for demanding industrial applications.
Technical Properties
| Item | Unit | Technical Data | Test Mode |
|---|---|---|---|
| Density | kg/m³ | ≥40 | ASTM D1622 / ISO 845 |
| Thermal Conductivity | W/(m*K) |
≤0.035 (+100℃) ≤0.029 (+50℃) ≤0.025 (+10℃) ≤0.024 (0℃) ≤0.023 (-50℃) ≤0.022 (-100℃) ≤0.017 (-150℃) ≤0.016 (-170℃) |
ASTM C177 |
| Compressive Strength | kPa |
≥200 (+23℃) ≥280 (-165℃) |
ASTM D 1621 |
| Tensile Strength | kPa |
≥320 (+23℃) ≥265 (-165℃) |
ASTM D 1623 |
| Flame Spread Index | ﹤25 | ASTM E84 | |
| Oxygen Index | ≥30 | GB/T 2406.2 | |
| Water Absorption by Vol. | % | ≤2 | ASTM D2842 |
| Water Vapor Permeability | ng/(Pa*s*m) | ≤5.5 | ASTM E96 |
| Closed Cell Ratio | % | ≥95 | ASTM D6226 |
| Lineal Thermal Expansion Coefficient | m/(m*K) | ≤70×10⁻⁶ | ASTM D696 |
| PH Value | 5.5-7 | ASTM C871 | |
| Chloride Content | ppm | ≤60 | GB/T 11835 |
| Elastic Modulus | MPa | ≤16 | ASTM D1623 |
| Service Temp. | ℃ | -196～+120 |
Applications
As an ideal organic low-temperature thermal insulation material, PIR insulation board features small thermal conductivity and high dimensional stability. Suitable for a wide temperature range, it is extensively used in LNG, ethylene, cold storage, and other low-temperature industries.
Typical PIR Insulation System Structure
- PIR Shell: inner layer + middle layer (if necessary) + outer layer
- Secondary Vapor Barrier: PAP aluminum foil
- Main Vapor Barrier: mastic + fiberglass meshes + mastic
- Metal Protective Layer: aluminum alloy plate, stainless steel plate, aluminized steel plate, GRP
- Sealant: HS-10-02, Foster 95-50, etc
- Strapping Material: stainless steel tape, sub sensitive tape
Packing and Storage
- Store in a dry, lightproof, shady, and ventilated place
- Keep away from heat sources and protect from sun exposure
- Inner package: black polyethylene bags
- Outer package: cartons
Cautions
- Handle gently - avoid rolling, collision, and heavy pressure during movement
- When applied to pipe and equipment insulation, fasten with glass fiber tape or steel band
- Cut with saw during application
Production Flow
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