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Rigid PIR Insulation Board , PIR Foam Board High Dimensional Stability

Brand Name:	Kaff Rees
MOQ:	20 Cubic Meters
Price:	Negotiable
Payment Terms:	EXW/FOB/CIF
Supply Ability:	According to products

Detail Information

Product Description

Detail Information

Place of Origin:

Changzhou, Jiangsu,China

Certification:

SGS

Name:

Rigid PIR Insulation Board

Cold Insulation Material:

Polyisocyanurate PIR

Feature:

High Dimensional Stability

PH Value:

5.5-7

Service Temp.:

-196～+120℃

Application:

Low Temperature Industries

Packaging Details:

Carton packaging/Wooden case packaging/according to the requirements

Highlight:

polyisocyanurate insulation board

pir foam insulation boards

Product Description

Rigid PIR Insulation Board, PIR Foam Board High Dimensional Stability

Key Features

Fire resistance rated as B1
Operating temperature range -196℃ to +120℃
Excellent dimensional stability
Customizable cutting in panels and pipes according to requirements

Product Introduction

Polyisocyanurate (PIR) is a foaming material made by the polymerization of isocyanate and polyether. With superior physical and fire resistance properties compared to polyurethane, it offers excellent thermal insulation with small thermal conductivity and high dimensional stability. This organic rigid thermal insulation material is ideal for demanding industrial applications.

Technical Properties

Item	Unit	Technical Data	Test Mode
Density	kg/m³	≥40	ASTM D1622 / ISO 845
Thermal Conductivity	W/(m*K)	≤0.035 (+100℃) ≤0.029 (+50℃) ≤0.025 (+10℃) ≤0.024 (0℃) ≤0.023 (-50℃) ≤0.022 (-100℃) ≤0.017 (-150℃) ≤0.016 (-170℃)	ASTM C177
Compressive Strength	kPa	≥200 (+23℃) ≥280 (-165℃)	ASTM D 1621
Tensile Strength	kPa	≥320 (+23℃) ≥265 (-165℃)	ASTM D 1623
Flame Spread Index		﹤25	ASTM E84
Oxygen Index		≥30	GB/T 2406.2
Water Absorption by Vol.	%	≤2	ASTM D2842
Water Vapor Permeability	ng/(Pasm)	≤5.5	ASTM E96
Closed Cell Ratio	%	≥95	ASTM D6226
Lineal Thermal Expansion Coefficient	m/(m*K)	≤70×10⁻⁶	ASTM D696
PH Value		5.5-7	ASTM C871
Chloride Content	ppm	≤60	GB/T 11835
Elastic Modulus	MPa	≤16	ASTM D1623
Service Temp.	℃	-196～+120

Applications

As an ideal organic low-temperature thermal insulation material, PIR insulation board features small thermal conductivity and high dimensional stability. Suitable for a wide temperature range, it is extensively used in LNG, ethylene, cold storage, and other low-temperature industries.

Typical PIR Insulation System Structure

PIR Shell: inner layer + middle layer (if necessary) + outer layer
Secondary Vapor Barrier: PAP aluminum foil
Main Vapor Barrier: mastic + fiberglass meshes + mastic
Metal Protective Layer: aluminum alloy plate, stainless steel plate, aluminized steel plate, GRP
Sealant: HS-10-02, Foster 95-50, etc
Strapping Material: stainless steel tape, sub sensitive tape

Packing and Storage

Store in a dry, lightproof, shady, and ventilated place
Keep away from heat sources and protect from sun exposure
Inner package: black polyethylene bags
Outer package: cartons

Cautions

Handle gently - avoid rolling, collision, and heavy pressure during movement
When applied to pipe and equipment insulation, fasten with glass fiber tape or steel band
Cut with saw during application

Production Flow

Tags:

Pipe Insulation Materials

Pipe Insulation Supports

Pipe Insulation Auxiliary Materials

Building Insulation Materials

Polyisocyanurate Foam Pipe Insulation

Hard Polyurethane

Foam Glass Insulation

Sealant Putty

PIR Insulated Pipe Supports

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