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Low Thermal Conductivity PIR Polyisocyanurate Insulation Board Custom Thickness

Brand Name:	Kaff Rees
MOQ:	20 Cubic Meters
Price:	Negotiable
Payment Terms:	EXW/FOB/CIF
Supply Ability:	According to products

Detail Information

Product Description

Detail Information

Place of Origin:

Changzhou, Jiangsu,China

Certification:

SGS

Name:

PIR Polyisocyanurate Insulation Board

Feature:

Easy Cutting

Cold Insulation Material:

Polyisocyanurate PIR

PH Value:

5.5-7

Service Temp.:

-196～+120℃

Application:

Low Temperature Industries

Packaging Details:

Carton packaging/Wooden case packaging/according to the requirements

Highlight:

Custom Thickness Polyisocyanurate Insulation Board

Low Thermal Conductivity Pir Board

PIR Insulation Board Custom Thickness

Product Description

Low Thermal Conductivity PIR Polyisocyanurate Insulation Board Custom Thickness

Why Choose Us?

We're the largest manufacturer and leader of this industry in China
Various styles for you to choose
High and stable quality with competitive price
Short lead time
Sample order or smaller quantity will be appreciated
Best service will be offered to our clients

Product Introduction

Polyisocyanurate (PIR) is a foaming material made by the polymerization of isocyanate and polyether. Its physical and fire resistance properties are superior to polyurethane. With excellent thermal conductivity and dimensional stability, it belongs to the category of organic hard thermal insulation materials.

Key Features

Fire resistance rated as B1
Operating temperature range: -196℃ to +120℃
Excellent dimensional stability
Customizable cutting in panels and pipes according to requirements

Technical Properties

Item	Unit	Technical Data	Test Mode
Density	kg/m3	≥40	ASTM D1622 / ISO 845
Thermal Conductivity	W/(m*K)	≤0.035 (+100℃)	ASTM C177
		≤0.029 (+50℃)
		≤0.025 (+10℃)
		≤0.024 (0℃)
		≤0.023 (-50℃)
		≤0.022 (-100℃)
		≤0.017 (-150℃)
		≤0.016 (-170℃)
Compressive Strength	kPa	+23℃: ≥200 -165℃: ≥280	ASTM D 1621
Tensile Strength	kPa	+23℃: ≥320 -165℃: ≥265	ASTM D 1623
Flame Spread Index		﹤25	ASTM E84
Oxygen index		≥30	GB/T 2406.2
Water Absorption by Vol.	%	≤2	ASTM D2842
Water Vapor Permeability	ng/(Pasm)	≤5.5	ASTM E96
Closed Cell Ratio	%	≥95	ASTM D6226
Lineal Thermal Expansion Coefficient	m/(m*K)	≤70×10-6	ASTM D696
PH Value		5.5-7	ASTM C871
Chloride Content	ppm	≤60	GB/T 11835
Elastic Modulus	MPa	≤16	ASTM D1623
Service Temp.	℃	-196～+120

Applications

As an ideal organic low-temperature heat insulation material with excellent thermal conductivity and dimensional stability, PIR is suitable for a wide temperature range. It is widely used in LNG, ethylene, cold storage, and other low-temperature industries.

Typical PIR Insulation System Structure

PIR Shell: inner layer + middle layer (if necessary) + outer layer
Secondary Vapor Barrier: PAP aluminum foil
Main Vapor Barrier: mastic + fiberglass meshes + mastic
Metal Protective Layer: aluminum alloy plate, stainless steel plate, aluminized steel plate, GRP
Sealant: HS-10-02, Foster 95-50, etc
Strapping Material: stainless steel tape, sub sensitive tape

Packing and Storage

Store in a dry, lightproof, shady, and ventilated place, keep away from heat source and protect from sun exposure
The inner package is packed in black polyethylene bags and the outer package is packed in cartons

Handling Cautions

Handle PIR gently, avoid rolling, collision and heavy pressure during moving
When applied to pipe and equipment insulation, PIR shall be fastened with glass fiber tape or steel band
Cut with saw during application

Production Flow

Tags:

Pipe Insulation Materials

Pipe Insulation Supports

Pipe Insulation Auxiliary Materials

Building Insulation Materials

Polyisocyanurate Foam Pipe Insulation

Hard Polyurethane

Foam Glass Insulation

Sealant Putty

PIR Insulated Pipe Supports

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