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Low Thermal Conductivity PIR Polyisocyanurate Insulation Board Custom Thickness

Place of Origin Changzhou, Jiangsu,China
Brand Name Kaff Rees
Certification SGS
Minimum Order Quantity 20 Cubic Meters
Price Negotiable
Packaging Details Carton packaging/Wooden case packaging/according to the requirements
Delivery Time Negotiable
Payment Terms EXW/FOB/CIF
Supply Ability According to products
Product Details
Name PIR Polyisocyanurate Insulation Board Feature Easy Cutting
Cold Insulation Material Polyisocyanurate PIR PH Value 5.5-7
Service Temp. -196~+120℃ Application Low Temperature Industries
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Custom Thickness Polyisocyanurate Insulation Board

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Low Thermal Conductivity Pir Board

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PIR Insulation Board Custom Thickness

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Product Description
Low Thermal Conductivity PIR Polyisocyanurate Insulation Board Custom Thickness
Why Choose Us?
  • We're the largest manufacturer and leader of this industry in China
  • Various styles for you to choose
  • High and stable quality with competitive price
  • Short lead time
  • Sample order or smaller quantity will be appreciated
  • Best service will be offered to our clients
Product Introduction
Polyisocyanurate (PIR) is a foaming material made by the polymerization of isocyanate and polyether. Its physical and fire resistance properties are superior to polyurethane. With excellent thermal conductivity and dimensional stability, it belongs to the category of organic hard thermal insulation materials.
Key Features
  • Fire resistance rated as B1
  • Operating temperature range: -196℃ to +120℃
  • Excellent dimensional stability
  • Customizable cutting in panels and pipes according to requirements
Technical Properties
Item Unit Technical Data Test Mode
Density kg/m3 ≥40 ASTM D1622 / ISO 845
Thermal Conductivity W/(m*K) ≤0.035 (+100℃) ASTM C177
≤0.029 (+50℃)
≤0.025 (+10℃)
≤0.024 (0℃)
≤0.023 (-50℃)
≤0.022 (-100℃)
≤0.017 (-150℃)
≤0.016 (-170℃)
Compressive Strength kPa +23℃: ≥200
-165℃: ≥280
ASTM D 1621
Tensile Strength kPa +23℃: ≥320
-165℃: ≥265
ASTM D 1623
Flame Spread Index ﹤25 ASTM E84
Oxygen index ≥30 GB/T 2406.2
Water Absorption by Vol. % ≤2 ASTM D2842
Water Vapor Permeability ng/(Pa*s*m) ≤5.5 ASTM E96
Closed Cell Ratio % ≥95 ASTM D6226
Lineal Thermal Expansion Coefficient m/(m*K) ≤70×10-6 ASTM D696
PH Value 5.5-7 ASTM C871
Chloride Content ppm ≤60 GB/T 11835
Elastic Modulus MPa ≤16 ASTM D1623
Service Temp. -196~+120
Applications
As an ideal organic low-temperature heat insulation material with excellent thermal conductivity and dimensional stability, PIR is suitable for a wide temperature range. It is widely used in LNG, ethylene, cold storage, and other low-temperature industries.
Typical PIR Insulation System Structure
PIR Insulation System Structure Diagram
  • PIR Shell: inner layer + middle layer (if necessary) + outer layer
  • Secondary Vapor Barrier: PAP aluminum foil
  • Main Vapor Barrier: mastic + fiberglass meshes + mastic
  • Metal Protective Layer: aluminum alloy plate, stainless steel plate, aluminized steel plate, GRP
  • Sealant: HS-10-02, Foster 95-50, etc
  • Strapping Material: stainless steel tape, sub sensitive tape
Packing and Storage
  • Store in a dry, lightproof, shady, and ventilated place, keep away from heat source and protect from sun exposure
  • The inner package is packed in black polyethylene bags and the outer package is packed in cartons
Handling Cautions
  • Handle PIR gently, avoid rolling, collision and heavy pressure during moving
  • When applied to pipe and equipment insulation, PIR shall be fastened with glass fiber tape or steel band
  • Cut with saw during application
Production Flow
PIR Production Flow Diagram