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Easy Cutting Polyiso Foam Board Organic Hard Thermal Insulation Material

Easy Cutting Polyiso Foam Board Organic Hard Thermal Insulation Material

Brand Name: Kaff Rees
MOQ: 20 Cubic Meters
Price: Negotiable
Payment Terms: EXW/FOB/CIF
Supply Ability: According to products
Detail Information
Place of Origin:
Changzhou, Jiangsu,China
Certification:
SGS
Name:
Polyiso Foam Board
Feature:
High Dimensional Stability
Cold Insulation Material:
Polyisocyanurate PIR
PH Value:
5.5-7
Service Temp.:
-196~+120℃
Application:
Low Temperature Industries
Packaging Details:
Carton packaging/Wooden case packaging/according to the requirements
Highlight:

polyisocyanurate insulation board

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pir foam insulation boards

Product Description
Easy Cutting Polyiso Foam Board Organic Hard Thermal Insulation Material
Application
This ideal organic low-temperature heat insulation material features small thermal conductivity and high dimensional stability. Suitable for a wide temperature range, it is widely used in LNG, ethylene, cold storage, and other low-temperature industries.
Product Introduction
Polyisocyanurate (PIR) is a foaming material made by polymerizing isocyanate and polyether. With superior physical and fire resistance properties compared to polyurethane, this organic hard thermal insulation material offers excellent thermal conductivity and dimensional stability.
Features
  • Fire resistance rated as B1
  • Operating temperature range: -196℃ to +120℃
  • Excellent dimensional stability
  • Customizable cutting in panels and pipes according to requirements
Technical Properties
Item Unit Technical Data Test Mode
Density kg/m3 ≥40 ASTM D1622 / ISO 845
Thermal Conductivity W/(m*K) ≤0.035 (+100℃)
≤0.029 (+50℃)
≤0.025 (+10℃)
≤0.024 (0℃)
≤0.023 (-50℃)
≤0.022 (-100℃)
≤0.017 (-150℃)
≤0.016 (-170℃)
ASTM C177
Compressive Strength kPa +23℃: ≥200
-165℃: ≥280
ASTM D 1621
Tensile Strength kPa +23℃: ≥320
-165℃: ≥265
ASTM D 1623
Flame Spread Index ﹤25 ASTM E84
Oxygen index ≥30 GB/T 2406.2
Water Absorption by Vol. % ≤2 ASTM D2842
Water Vapor Permeability ng/(Pa*s*m) ≤5.5 ASTM E96
Closed Cell Ratio % ≥95 ASTM D6226
Lineal Thermal Expansion Coefficient m/(m*K) ≤70×10-6 ASTM D696
PH Value 5.5-7 ASTM C871
Chloride Content ppm ≤60 GB/T 11835
Elastic Modulus MPa ≤16 ASTM D1623
Service Temp. -196~+120
Typical PIR Insulation System Structure
Easy Cutting Polyiso Foam Board Organic Hard Thermal Insulation Material 0
  1. PIR Shell: inner layer + middle layer (if necessary) + outer layer
  2. Secondary Vapor Barrier: PAP aluminum foil
  3. Main Vapor Barrier: mastic + fiberglass meshes + mastic
  4. Metal Protective Layer: aluminum alloy plate, stainless steel plate, aluminized steel plate, GRP
  5. Sealant: HS-10-02, Foster 95-50, etc
  6. Strapping Material: stainless steel tape, sub sensitive tape
Packing and Storage
  • Store in a dry, lightproof, shady, and ventilated place, away from heat sources and protected from sun exposure
  • Inner package: black polyethylene bags; Outer package: cartons
Cautions
  • Handle PIR gently, avoiding rolling, collision, and heavy pressure during movement
  • When applied to pipe and equipment insulation, fasten PIR with glass fiber tape or steel band
  • Use a saw for cutting during application
Production Flow
Easy Cutting Polyiso Foam Board Organic Hard Thermal Insulation Material 1