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Fireproof PIR Thermal Insulation Board Wide Operating Temperature Range

Place of Origin Changzhou, Jiangsu,China
Brand Name Kaff Rees
Certification SGS
Minimum Order Quantity 20 Cubic Meters
Price Negotiable
Packaging Details Carton packaging/Wooden case packaging/according to the requirements
Delivery Time Negotiable
Payment Terms EXW/FOB/CIF
Supply Ability According to products
Product Details
Name PIR Thermal Insulation Board Feature Fireproof
Cold Insulation Material Polyisocyanurate PIR PH Value 5.5-7
Service Temp. -196~+120℃ Application Low Temperature Industries
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Product Description
Fireproof PIR Thermal Insulation Board Wide Operating Temperature Range
Product Description
Polyisocyanurate (PIR) is a foaming material made by the polymerization of isocyanate and polyether. Its physical and fire resistance properties are superior to polyurethane, featuring small thermal conductivity and high dimensional stability. It belongs to the category of organic hard thermal insulation materials.
Typical PIR Insulation System Structure
  • PIR Shell: inner layer + middle layer (if necessary) + outer layer
  • Secondary Vapor Barrier: PAP aluminum foil
  • Main Vapor Barrier: mastic + fiberglass meshes + mastic
  • Metal Protective Layer: aluminum alloy plate, stainless steel plate, aluminized steel plate, GRP
  • Sealant: HS-10-02, Foster 95-50, etc
  • Strapping Material: stainless steel tape, sub sensitive tape
PIR Thermal Insulation Board structure diagram
Key Features
Fire resistance rated as B1
Operating temperature range: -196℃ to +120℃
Excellent dimensional stability
Customizable cutting in panels and pipes according to requirements
Technical Properties
Item Unit Technical Data Test Mode
Density kg/m3 ≥40 ASTM D1622 / ISO 845
Thermal Conductivity W/(m*K) ≤0.035 (+100℃)
≤0.029 (+50℃)
≤0.025 (+10℃)
≤0.024 (0℃)
≤0.023 (-50℃)
≤0.022 (-100℃)
≤0.017 (-150℃)
≤0.016 (-170℃)
ASTM C177
Compressive Strength kPa +23℃: ≥200
-165℃: ≥280
ASTM D 1621
Tensile Strength kPa +23℃: ≥320
-165℃: ≥265
ASTM D 1623
Flame Spread Index ﹤25 ASTM E84
Oxygen index ≥30 GB/T 2406.2
Water Absorption by Vol. % ≤2 ASTM D2842
Water Vapor Permeability ng/(Pa*s*m) ≤5.5 ASTM E96
Closed Cell Ratio % ≥95 ASTM D6226
Lineal Thermal Expansion Coefficient m/(m*K) ≤70×10-6 ASTM D696
PH Value 5.5-7 ASTM C871
Chloride Content ppm ≤60 GB/T 11835
Elastic Modulus MPa ≤16 ASTM D1623
Service Temp. -196~+120
Applications
PIR is an ideal organic low-temperature heat insulation material with small thermal conductivity and high dimensional stability. Suitable for a wide temperature range, it is widely used in LNG, ethylene, cold storage and other low-temperature industries.
Packing and Storage
  • Store in a dry, lightproof, shady, and ventilated place
  • Keep away from heat sources and protect from sun exposure
  • Inner package: black polyethylene bags
  • Outer package: cartons
Cautions
  • Handle PIR gently, avoid rolling, collision and heavy pressure during moving
  • When applied to pipe and equipment insulation, fasten with glass fiber tape or steel band
  • Cut with saw during application
Production Flow
PIR Thermal Insulation Board production flow diagram